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IDH02G65C5 SiC Schottky Diode Data
Key data for the IDH02G65C5 silicon carbide Schottky diode including key electrical parameters, performance, features, outline, package type and many other key datasheet details.
The IDH02G65C5 SiC Schottky diode uses the Infineon ThinQ! Generation 5 process for leading edge technology SiC Schottky Barrier diodes.
The Infineon proprietary diffusion soldering process, already introduced with G3 is now combined with a new, more compact design and thin-wafer technology for this product.
The result is a new family of products showing improved efficiency over all load conditions, resulting from both the improved thermal characteristics and a lower figure of merit (Qc x Vf).
Key details and datasheet performance parameters for the IDH02G65C5 SiC Schottky diode.
| IDH02G65C5 SiC Schottky diode datasheet parameters & data |
|
|---|---|
| Parameters | Details |
| Diode type | 650V 2A SiC Schottky diode |
| Package type | TO220-2 |
| Repetitive peak reverse voltage, VRRM | 650V |
| Forward continuous current, IF | 2A |
| Average rectified current, IF | |
| Non-repetitive forward surge current, IFSM | 23A at 25°C, 22A at 150°C |
| Power dissipation, PTOT | 36W |
| Junction temperature (°C) | -55 to +175°C |
| Forward voltage VF | 1.5V typ, 1.7V max at 2 A and 25°C 1.8V typ, 2.1V max at 2 A and 150°C |
| Reverse leakage IR | 0.1µA typ, 35µA max at VR = 650V at TJ = 25°C 0.02µA typ, 12µA max at VR = 600V at TJ = 25°C 0.4µA typ, 240µA max at VR = 650V at TJ = 150°C |
| Diode capacitance CD | 70pF for VR = 1V, and 9.1pF for VR = 300V |
| Primary manufacturer | Infineon |
Outline & pinout:
Explanation of major silicon carbide Schottky diode parameters
| Parameter | Explanation |
|---|---|
| Repetitive peak reverse voltage, VRRM | This is the maximum value of the short period peak reverse voltage that can be sustained. |
| Working peak reverse voltage, VRWM | This is the maximum value of the continuous reverse voltage that can be applied to the diode. |
| DC blocking voltage, VR | This is the maximum reverse DC voltage that should be applied across the diode. |
| RMS reverse voltage, VR(RMS) | As many AC waveforms are quoted in RMS, this is the maximum reverse voltage that can be sustained where the voltage is expressed in terms of its RMS value. |
| Forward continuous current, IF | This is the maximum forward current that can be sustained by the diode. |
| Average rectified current, IF | This is the maximum average current value that can be handled by the diode. The parameter often states the load as this will affect the operation of the diode. |
| Non-repetitive forward surge current, IFSM | This is the maximum surge current that can be handled - it should only be present for a short time. |
| Parameter | Explanation |
|---|---|
| Power dissipation, PTOT | The maximum power dissipation that can be sustained within the device. |
| Junction temperature (°C) | This is the maximum temperature of the PN junction that can be sustained. Remember that the junction temperature can be much higher than the ambient temperature of the equipment. |
| Forward voltage VF | This parameter gives the forward voltage drop for a particular current passed through the diode. |
| Breakdown voltage VBR | This is the minimum voltage at which the diode may breakdown. If the current is not limited it will lead to the destruction of the device. |
| Leakage current IR | This is the current that flows under stated conditions when the diode is reverse biassed. |
| Diode capacitance CD | The diode capacitance, CD may also be referred to as the junction capacitance, CJ. All diodes have a certain capacitance across the PN junction. The value will be stated for a given reverse voltage. |
| Reverse recovery time | If a diode is initially driven in forward bias, and the polarity suddenly switches to reverse bias, the diode will still remain conducting for some time. The reverse recovery time is the time required for conduction to settle into the reverse bias state. |
These are the main Schottky diode parameters that have been included in our list. There are others, but these help quantify the main elements of the performance of the diode.
Please note, that the data given is the best estimate we can give within a tabulated summary of this nature. Parameters also vary between manufacturers. Electronics Notes cannot accept any responsibility for errors, inaccuracies, etc, although we do endevaour to ensure the data is as accurate as possible.
Notes and supplementary information
• Availability & sources
The IDH02G65C5 is available from a number of stockists and electronic component distributors many of which are given in the table below.
IDH02G65C5 Component Distributor, Stock and Pricing
• Notable features
The Infineon IDH02G65C5 is a 650V, 2A Silicon Carbide (SiC) Schottky Diode, part of the 5th Generation thinQ!™ series, designed to set a new benchmark for efficiency and switching performance in high-frequency power applications.
Zero Reverse Recovery: Unlike traditional silicon (Si) PN diodes, the SiC Schottky structure has virtually no reverse recovery charge (Qc) and no forward recovery. This eliminates switching losses, leading to a significant improvement in system efficiency.
Temperature Independent Switching: The diode's switching behaviour remains stable across its operating temperature range (Tj up to +175∘C), which simplifies thermal design and improves overall system reliability.
High Operating Temperature: It is rated for a maximum junction temperature (Tj,max) of +175∘C, enabling operation in high-power density environments and allowing for reduced heatsink size (System size / cost savings).
Low Figure of Merit: The 5th generation technology features a thin wafer design resulting in an improved Figure of Merit (Qc×Vf), meaning lower conduction and switching losses across all load conditions.
High Voltage Rating: With a repetitive peak reverse voltage (VRRM) of 650V, it is ideally suited for 400V/450V DC bus applications, where it is often paired with 650V Si MOSFETs (like Infineon's CoolMOS™).
Low Reverse Leakage: Exhibits very low reverse leakage current (IR), which contributes to reduced power loss during the diode's blocking state, especially at lower load conditions.
• Typical applications summary
| Application Category | Typical Use Case | Device Feature Utilised |
|---|---|---|
| Power Factor Correction (PFC) | Continuous Conduction Mode (CCM) PFC stage in AC-DC power supplies | No Reverse Recovery, enabling higher switching frequencies and reducing switching losses in the boost diode. |
| Server/Telecom Power Supplies | High-efficiency SMPS (Switch-Mode Power Supplies) and power modules | High efficiency and high Tj,max, leading to increased power density and smaller magnetics (inductors/transformers). |
| Solar Inverters / UPS | Boost stages and output rectification in photovoltaic string inverters and Uninterruptible Power Supplies | Temperature Independent Switching and High Reliability, ensuring stable performance and longevity in demanding outdoor/industrial environments. |
| Electric Vehicle (EV) Charging | On-Board Chargers (OBCs) for EVs | High Efficiency and Compact TO-220 Package, facilitating higher power output from a constrained volume inside the vehicle. |
Written by Ian Poole .
Experienced electronics engineer and author.
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